Detailed Aluminum Nitride Substrate Description
Features:
a) Thermal conductivity: High thermal conductivity about 7 times that
of alumina.
b) Coefficient of thermal expansion: Having coefficient of thermal
expansion similar to that of silicon, it realizes a high
reliability against installation of a large Si chip and heat
cycle.
c) Electrical characteristic: High electric insulation, and low
dielectric constant.
d) Mechanical characteristics: Mechanical strength higher than that
of alumina.
e) Corrosion resistance: Superior corrosion resistance against
molten metal.
f) Purity: Very small content of impurities, no toxicity, high
purity.
Board, general tolerance
1 Thickness tolerance of both - side polished
product: ±0.05mm
2 Warp of both - side polished product: ±0.0015mm / mm
Physical properties (principal )
Alumina substrates [Al2O3]
Substrate for chip resistors and network
Features:
a) Equal crystal size and high sintering density
b) Excellent thick film characteristic
c) Small camber
d) To be easily divided along snap line
e) Precise internal and external dimension
Table of size tolerance Unit: mm ()
Our Aluminum Nitride Substrate comply with International Quality Standards and their quality and durability are fully guranteed.
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Contact information:
Inquire
| Address: |
6 / F, No.142 Tianlin Road, Shanghai City. China |
| Company Name: |
Shanghai Unist International Trading Co., Ltd. |
| Contact Person: |
Ms. Claire Chen, Mr. Jeffrey Peng |
| Fax: |
86-21-64859913 |
| Telephone: |
86-21-54263347,54263348,54263349 |
| Website: |
http://www.unist.com.tw |
| Zip: |
200233 |
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